Design and Design Automation for a Future Generation of Chips
Monday | October 28, 2024
Three dimensional integration is one of the major technology directions for integrated circuits [1]. Nanosystems of 3D integrated “X” technology (N3XT) is a key concept at the chip level, where X can be memory, photonics, spintronics, power electronics, nanomechanics, sensors and actuators, and RF/mm-wave [2]. We must also go beyond a single chip from a wafer and focus on integrating chips into systems using MOSAIC (MOnolithic Stacked Assembled IC) [3]. These future 3D systems require a complete overhaul of the design methodology and design automation. Designs of 3D systems must start from the fundamental assumption that interconnections are in 3D and the interconnection density in all three dimensions are equally dense and efficient. This presents tremendous opportunities for research on system architecture and design automation.