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style=\"list-style-type:decimal;\">\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://jobs.utdallas.edu/postings/27382\">\u003Cspan style=\"color:#1155cc;\">\u003Cu>Assistant and Associate Professor in Electrical and Computer Engineering\u003C/u>\u003C/span>\u003C/a>\u003C/li>\u003C/ol>","2024-10-21T16:22:25.910Z","2024-10-26T20:57:21.210Z","2024-10-21T16:22:27.674Z","205",{"id":1144,"name":1145,"alternativeText":15,"caption":15,"width":1146,"height":1147,"formats":1148,"hash":1166,"ext":18,"mime":19,"size":1167,"url":1168,"previewUrl":15,"provider":22,"provider_metadata":15,"createdAt":1169,"updatedAt":1169},134,"monogram-emblem-border-880-1.png",880,587,{"small":1149,"medium":1155,"thumbnail":1160},{"ext":18,"url":1150,"hash":1151,"mime":19,"name":1152,"path":15,"size":1153,"width":648,"height":1154},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/small_monogram_emblem_border_880_1_8faf9d88be.png","small_monogram_emblem_border_880_1_8faf9d88be","small_monogram-emblem-border-880-1.png",22.25,334,{"ext":18,"url":1156,"hash":1157,"mime":19,"name":1158,"path":15,"size":1159,"width":655,"height":648},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/medium_monogram_emblem_border_880_1_8faf9d88be.png","medium_monogram_emblem_border_880_1_8faf9d88be","medium_monogram-emblem-border-880-1.png",35.91,{"ext":18,"url":1161,"hash":1162,"mime":19,"name":1163,"path":15,"size":1164,"width":1165,"height":622},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/thumbnail_monogram_emblem_border_880_1_8faf9d88be.png","thumbnail_monogram_emblem_border_880_1_8faf9d88be","thumbnail_monogram-emblem-border-880-1.png",9.35,234,"monogram_emblem_border_880_1_8faf9d88be",7.26,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/monogram_emblem_border_880_1_8faf9d88be.png","2024-10-21T16:21:43.033Z",{"id":1171,"variation":595,"button":1172},61,[1173],{"id":212,"label":598,"size":599,"color":600,"style":15,"icon":601,"iconPosition":602,"url":1174,"newWindow":8,"downloadable":15,"shape":15},"https://www.utdallas.edu/","-164",{"id":206,"name":1177,"description":1178,"createdAt":1179,"updatedAt":1180,"publishedAt":1181,"url_path_id":1182,"logo":1183,"website":1197,"url_path":1202},"Peking University","\u003Cp>Openings:\u003C/p>\u003Col style=\"list-style-type:decimal;\">\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://drive.google.com/file/d/1Kh6kLqgXyZ-yHFcFpN0LtNoZA0l3s-bK/view?usp=drive_link\">Multiple tenure-track faculty positions\u003C/a>\u003C/li>\u003C/ol>","2024-10-21T16:22:51.218Z","2024-10-26T20:55:41.318Z","2024-10-21T16:22:53.136Z","206",{"id":649,"name":1184,"alternativeText":15,"caption":15,"width":1185,"height":1102,"formats":1186,"hash":1193,"ext":18,"mime":19,"size":1194,"url":1195,"previewUrl":15,"provider":22,"provider_metadata":15,"createdAt":1196,"updatedAt":1196},"images (3).png",391,{"thumbnail":1187},{"ext":18,"url":1188,"hash":1189,"mime":19,"name":1190,"path":15,"size":1191,"width":589,"height":1192},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/thumbnail_images_3_68cbc0fd43.png","thumbnail_images_3_68cbc0fd43","thumbnail_images (3).png",17.77,81,"images_3_68cbc0fd43",7.83,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/images_3_68cbc0fd43.png","2024-10-21T16:21:42.687Z",{"id":1198,"variation":595,"button":1199},62,[1200],{"id":894,"label":598,"size":599,"color":600,"style":15,"icon":601,"iconPosition":602,"url":1201,"newWindow":8,"downloadable":15,"shape":15},"https://english.pku.edu.cn/","-165",{"id":160,"name":1204,"description":45,"createdAt":1205,"updatedAt":1206,"publishedAt":1207,"url_path_id":1208,"logo":1209,"website":1231,"url_path":1235},"Chinese University of Hong Kong","2024-10-21T16:23:31.393Z","2024-10-21T16:25:07.701Z","2024-10-21T16:25:07.690Z","207",{"id":1210,"name":1211,"alternativeText":15,"caption":15,"width":1212,"height":1213,"formats":1214,"hash":1227,"ext":18,"mime":19,"size":1228,"url":1229,"previewUrl":15,"provider":22,"provider_metadata":15,"createdAt":1230,"updatedAt":1230},137,"cuhk_logo_2x.png",556,100,{"small":1215,"thumbnail":1221},{"ext":18,"url":1216,"hash":1217,"mime":19,"name":1218,"path":15,"size":1219,"width":648,"height":1220},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/small_cuhk_logo_2x_2674588b4f.png","small_cuhk_logo_2x_2674588b4f","small_cuhk_logo_2x.png",33.47,90,{"ext":18,"url":1222,"hash":1223,"mime":19,"name":1224,"path":15,"size":1225,"width":589,"height":1226},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/thumbnail_cuhk_logo_2x_2674588b4f.png","thumbnail_cuhk_logo_2x_2674588b4f","thumbnail_cuhk_logo_2x.png",11.33,44,"cuhk_logo_2x_2674588b4f",8.47,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/cuhk_logo_2x_2674588b4f.png","2024-10-21T16:25:04.093Z",{"id":946,"variation":595,"button":1232},[1233],{"id":335,"label":598,"size":599,"color":600,"style":15,"icon":601,"iconPosition":602,"url":1234,"newWindow":8,"downloadable":15,"shape":15},"https://www.cuhk.edu.hk/","-166",{"id":310,"name":1237,"description":1238,"createdAt":1239,"updatedAt":1240,"publishedAt":1241,"url_path_id":1242,"logo":1243,"website":1276,"url_path":1280},"California State University, Long Beach","\u003Cp>Openings:\u003C/p>\u003Cp>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://urldefense.com/v3/__https://careers.pageuppeople.com/873/lb/en-us/job/543010/assistant-professor-of-computer-science__;!!IKRxdwAv5BmarQ!eQj8K4F3IfjWIwE6lI2-CE4VMHwlbceaBpx6Qm-22ksIX6ZjXv3PrCSF51VgT13ifmtvdqiqtUzmU1Zx7gIuBOf2bWY$\">Assistant Professor of Computer Science\u003C/a>\u003C/p>","2024-10-21T16:25:34.926Z","2024-10-27T19:26:45.135Z","2024-10-21T16:25:37.001Z","208",{"id":1244,"name":1245,"alternativeText":15,"caption":15,"width":1246,"height":1247,"formats":1248,"hash":1273,"ext":18,"mime":19,"size":81,"url":1274,"previewUrl":15,"provider":22,"provider_metadata":15,"createdAt":1275,"updatedAt":1275},136,"49e1116896ee3dd71dd426fcd25cc16b.png",1280,800,{"large":1249,"small":1255,"medium":1261,"thumbnail":1267},{"ext":18,"url":1250,"hash":1251,"mime":19,"name":1252,"path":15,"size":1253,"width":640,"height":1254},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/large_49e1116896ee3dd71dd426fcd25cc16b_10ef1ddb33.png","large_49e1116896ee3dd71dd426fcd25cc16b_10ef1ddb33","large_49e1116896ee3dd71dd426fcd25cc16b.png",52.7,625,{"ext":18,"url":1256,"hash":1257,"mime":19,"name":1258,"path":15,"size":1259,"width":648,"height":1260},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/small_49e1116896ee3dd71dd426fcd25cc16b_10ef1ddb33.png","small_49e1116896ee3dd71dd426fcd25cc16b_10ef1ddb33","small_49e1116896ee3dd71dd426fcd25cc16b.png",23.09,313,{"ext":18,"url":1262,"hash":1263,"mime":19,"name":1264,"path":15,"size":1265,"width":655,"height":1266},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/medium_49e1116896ee3dd71dd426fcd25cc16b_10ef1ddb33.png","medium_49e1116896ee3dd71dd426fcd25cc16b_10ef1ddb33","medium_49e1116896ee3dd71dd426fcd25cc16b.png",37.06,469,{"ext":18,"url":1268,"hash":1269,"mime":19,"name":1270,"path":15,"size":1271,"width":589,"height":1272},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/thumbnail_49e1116896ee3dd71dd426fcd25cc16b_10ef1ddb33.png","thumbnail_49e1116896ee3dd71dd426fcd25cc16b_10ef1ddb33","thumbnail_49e1116896ee3dd71dd426fcd25cc16b.png",10.13,153,"49e1116896ee3dd71dd426fcd25cc16b_10ef1ddb33","https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/49e1116896ee3dd71dd426fcd25cc16b_10ef1ddb33.png","2024-10-21T16:21:43.178Z",{"id":396,"variation":595,"button":1277},[1278],{"id":316,"label":598,"size":599,"color":600,"style":15,"icon":601,"iconPosition":602,"url":1279,"newWindow":8,"downloadable":15,"shape":15},"https://www.csulb.edu/","-167",{"id":227,"name":1282,"description":1283,"createdAt":1284,"updatedAt":1285,"publishedAt":1286,"url_path_id":1287,"logo":1288,"website":1320,"url_path":1325},"NVIDIA","\u003Cp>Openings:\u003C/p>\u003Cul>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/details/Research-Scientist--Design-Automation---New-College-Grad-2025_JR1989394-1?q=JR1989394\">Research scientist\u003C/a>\u003C/li>\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/US-CA-Santa-Clara/PhD-Research-Intern--Robotics-and-or-Autonomous-Vehicles---2025_JR1989940-1?q=JR1989940+PhD+Research+Intern,+Robotics+and/or+Autonomous+Vehicles+-+2025\">Internship link\u003C/a>\u003C/li>\u003C/ul>","2024-10-21T16:26:10.208Z","2024-10-28T21:11:00.165Z","2024-10-21T16:26:12.361Z","209",{"id":1289,"name":1290,"alternativeText":15,"caption":15,"width":1291,"height":1292,"formats":1293,"hash":1316,"ext":18,"mime":19,"size":1317,"url":1318,"previewUrl":15,"provider":22,"provider_metadata":15,"createdAt":1319,"updatedAt":1319},135,"nvidia-logo-horz.png",1070,601,{"large":1294,"small":1300,"medium":1305,"thumbnail":1311},{"ext":18,"url":1295,"hash":1296,"mime":19,"name":1297,"path":15,"size":1298,"width":640,"height":1299},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/large_nvidia_logo_horz_e2054e7730.png","large_nvidia_logo_horz_e2054e7730","large_nvidia-logo-horz.png",39.87,562,{"ext":18,"url":1301,"hash":1302,"mime":19,"name":1303,"path":15,"size":1304,"width":648,"height":1034},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/small_nvidia_logo_horz_e2054e7730.png","small_nvidia_logo_horz_e2054e7730","small_nvidia-logo-horz.png",14.82,{"ext":18,"url":1306,"hash":1307,"mime":19,"name":1308,"path":15,"size":1309,"width":655,"height":1310},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/medium_nvidia_logo_horz_e2054e7730.png","medium_nvidia_logo_horz_e2054e7730","medium_nvidia-logo-horz.png",25.1,421,{"ext":18,"url":1312,"hash":1313,"mime":19,"name":1314,"path":15,"size":1315,"width":589,"height":1046},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/thumbnail_nvidia_logo_horz_e2054e7730.png","thumbnail_nvidia_logo_horz_e2054e7730","thumbnail_nvidia-logo-horz.png",6.41,"nvidia_logo_horz_e2054e7730",8.64,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/nvidia_logo_horz_e2054e7730.png","2024-10-21T16:21:43.111Z",{"id":415,"variation":595,"button":1321},[1322],{"id":1323,"label":598,"size":599,"color":600,"style":15,"icon":601,"iconPosition":602,"url":1324,"newWindow":8,"downloadable":15,"shape":15},73,"https://www.nvidia.com/en-us/","-168",{"id":247,"name":1327,"description":1328,"createdAt":1329,"updatedAt":1330,"publishedAt":1331,"url_path_id":1332,"logo":1333,"website":1353,"url_path":1358},"Arizona State University","\u003Cp>Openings:\u003C/p>\u003Col style=\"list-style-type:decimal;\">\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://apply.interfolio.com/156770\">Professor (All Ranks) in Microelectronics\u003C/a>\u003C/li>\u003C/ol>","2024-10-21T16:27:22.029Z","2024-10-26T20:56:24.414Z","2024-10-21T16:27:23.897Z","210",{"id":1334,"name":1335,"alternativeText":15,"caption":15,"width":1336,"height":1337,"formats":1338,"hash":1349,"ext":18,"mime":19,"size":1350,"url":1351,"previewUrl":15,"provider":22,"provider_metadata":15,"createdAt":1352,"updatedAt":1352},130,"images (4).png",512,98,{"small":1339,"thumbnail":1344},{"ext":18,"url":1340,"hash":1341,"mime":19,"name":1342,"path":15,"size":1343,"width":648,"height":766},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/small_images_4_722bb37608.png","small_images_4_722bb37608","small_images (4).png",33.41,{"ext":18,"url":1345,"hash":1346,"mime":19,"name":1347,"path":15,"size":1348,"width":589,"height":539},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/thumbnail_images_4_722bb37608.png","thumbnail_images_4_722bb37608","thumbnail_images (4).png",13.53,"images_4_722bb37608",6.12,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/images_4_722bb37608.png","2024-10-21T16:21:42.665Z",{"id":1055,"variation":595,"button":1354},[1355],{"id":1356,"label":598,"size":599,"color":600,"style":15,"icon":601,"iconPosition":602,"url":1357,"newWindow":15,"downloadable":15,"shape":15},74,"https://www.asu.edu/","-169",{"id":509,"name":1360,"description":1361,"createdAt":1362,"updatedAt":1363,"publishedAt":1364,"url_path_id":1365,"logo":1366,"website":1386,"url_path":1390},"University of Wisconsin","\u003Cp>Openings:\u003C/p>\u003Col style=\"list-style-type:decimal;\">\u003Cli>\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://jobs.wisc.edu/jobs/professor-open-rank-in-electrical-computer-engineering-ai-for-chip-design-madison-wisconsin-united-states\">Professor (open rank) in Electrical & Computer Engineering - AI for Chip Design\u003C/a>\u003C/li>\u003C/ol>\u003Cp> \u003C/p>\u003Cp> \u003C/p>","2024-10-21T16:28:02.562Z","2024-10-26T20:56:56.929Z","2024-10-21T16:28:04.775Z","211",{"id":1367,"name":1368,"alternativeText":15,"caption":15,"width":1369,"height":1370,"formats":1371,"hash":1383,"ext":18,"mime":19,"size":180,"url":1384,"previewUrl":15,"provider":22,"provider_metadata":15,"createdAt":1385,"updatedAt":1385},132,"vert-w-crest-logo-web-digital-color.png",600,400,{"small":1372,"thumbnail":1378},{"ext":18,"url":1373,"hash":1374,"mime":19,"name":1375,"path":15,"size":1376,"width":648,"height":1377},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/small_vert_w_crest_logo_web_digital_color_beb0805fb0.png","small_vert_w_crest_logo_web_digital_color_beb0805fb0","small_vert-w-crest-logo-web-digital-color.png",62.38,333,{"ext":18,"url":1379,"hash":1380,"mime":19,"name":1381,"path":15,"size":1382,"width":1165,"height":622},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/thumbnail_vert_w_crest_logo_web_digital_color_beb0805fb0.png","thumbnail_vert_w_crest_logo_web_digital_color_beb0805fb0","thumbnail_vert-w-crest-logo-web-digital-color.png",20.47,"vert_w_crest_logo_web_digital_color_beb0805fb0","https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/vert_w_crest_logo_web_digital_color_beb0805fb0.png","2024-10-21T16:21:42.813Z",{"id":520,"variation":595,"button":1387},[1388],{"id":233,"label":598,"size":599,"color":600,"style":15,"icon":601,"iconPosition":602,"url":1389,"newWindow":8,"downloadable":15,"shape":15},"https://www.wisc.edu/","-170",{"id":200,"name":1392,"description":45,"createdAt":1393,"updatedAt":1394,"publishedAt":1395,"url_path_id":1396,"logo":1397,"website":1425,"url_path":1429},"Villanova University","2024-10-26T11:20:53.250Z","2024-10-26T11:20:55.579Z","2024-10-26T11:20:55.572Z","212",{"id":1046,"name":1398,"alternativeText":15,"caption":15,"width":1246,"height":1399,"formats":1400,"hash":1421,"ext":760,"mime":763,"size":1422,"url":1423,"previewUrl":15,"provider":22,"provider_metadata":15,"createdAt":1424,"updatedAt":1424},"image_1579638630.no.size.img.jpg",960,{"large":1401,"small":1406,"medium":1411,"thumbnail":1416},{"ext":760,"url":1402,"hash":1403,"mime":763,"name":1404,"path":15,"size":1405,"width":640,"height":655},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/large_image_1579638630_no_size_img_0c4aefb873.jpg","large_image_1579638630_no_size_img_0c4aefb873","large_image_1579638630.no.size.img.jpg",34.67,{"ext":760,"url":1407,"hash":1408,"mime":763,"name":1409,"path":15,"size":1410,"width":648,"height":1079},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/small_image_1579638630_no_size_img_0c4aefb873.jpg","small_image_1579638630_no_size_img_0c4aefb873","small_image_1579638630.no.size.img.jpg",13.1,{"ext":760,"url":1412,"hash":1413,"mime":763,"name":1414,"path":15,"size":1415,"width":655,"height":1028},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/medium_image_1579638630_no_size_img_0c4aefb873.jpg","medium_image_1579638630_no_size_img_0c4aefb873","medium_image_1579638630.no.size.img.jpg",22.85,{"ext":760,"url":1417,"hash":1418,"mime":763,"name":1419,"path":15,"size":1420,"width":621,"height":622},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/thumbnail_image_1579638630_no_size_img_0c4aefb873.jpg","thumbnail_image_1579638630_no_size_img_0c4aefb873","thumbnail_image_1579638630.no.size.img.jpg",3.51,"image_1579638630_no_size_img_0c4aefb873",49.04,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/image_1579638630_no_size_img_0c4aefb873.jpg","2024-10-26T11:20:33.114Z",{"id":1133,"variation":595,"button":1426},[1427],{"id":16,"label":598,"size":599,"color":600,"style":15,"icon":601,"iconPosition":602,"url":1428,"newWindow":15,"downloadable":15,"shape":15},"https://www1.villanova.edu/university.html","-171",{"id":324,"name":1431,"description":45,"createdAt":1432,"updatedAt":1433,"publishedAt":1434,"url_path_id":1435,"logo":1436,"website":1450,"url_path":1455},"Syracuse University","2024-10-26T18:34:30.431Z","2024-10-26T18:35:05.768Z","2024-10-26T18:35:05.761Z","213",{"id":1437,"name":1438,"alternativeText":15,"caption":15,"width":1439,"height":649,"formats":1440,"hash":1446,"ext":18,"mime":19,"size":1447,"url":1448,"previewUrl":15,"provider":22,"provider_metadata":15,"createdAt":1449,"updatedAt":1449},139,"images (5).png",384,{"thumbnail":1441},{"ext":18,"url":1442,"hash":1443,"mime":19,"name":1444,"path":15,"size":1445,"width":589,"height":582},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/thumbnail_images_5_292bd7738d.png","thumbnail_images_5_292bd7738d","thumbnail_images (5).png",12.99,"images_5_292bd7738d",4.92,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/images_5_292bd7738d.png","2024-10-26T18:34:09.860Z",{"id":212,"variation":595,"button":1451},[1452],{"id":1453,"label":598,"size":599,"color":600,"style":15,"icon":601,"iconPosition":602,"url":1454,"newWindow":8,"downloadable":15,"shape":15},77,"https://www.syracuse.edu/","-172",{"pagination":1457},{"page":5,"pageSize":324,"pageCount":27,"total":102},{"id":166,"heading":161,"pageHeader":1459,"sections":1461},{"id":166,"description":1460,"showPageHeader":8,"backgroundColor":49,"image":15}," ",[1462],{"id":5,"__component":1463,"componentVariation":1464,"contactsVariation":1465,"styles":15,"header":15,"sessionsGroup":1466},"content.sessions","Sessions Base","Card Contact Full",[1467,1641],{"id":5,"groupTitle":15,"sessions":1468},[1469,1509,1541,1588],{"id":67,"session":1470},{"id":67,"title":1471,"teaser":1472,"body":1473,"createdAt":1474,"updatedAt":1475,"publishedAt":1476,"url_path_id":1477,"contacts":1478,"url_path":1508},"Design and Design Automation for a Future Generation of Chips","\u003Ch4 class=\"h4\" style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:#537F9A;\">\u003Cstrong>Monday | October 28, 2024 | 8:30 - 9:30\u003C/strong>\u003C/span>\u003C/h4>\u003Cp style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:#000000;\">Three dimensional integration is one of the major technology directions for integrated circuits [1]. Nanosystems of 3D integrated “X” technology (N3XT) is a key concept at the chip level, where X can be memory, photonics, spintronics, power electronics, nanomechanics, sensors and actuators, and RF/mm-wave [2]. We must also go beyond a single chip from a wafer and focus on integrating chips into systems using MOSAIC (MOnolithic Stacked Assembled IC) [3]. These future 3D systems require a complete overhaul of the design methodology and design automation. Designs of 3D systems must start from the fundamental assumption that interconnections are in 3D and the interconnection density in all three dimensions are equally dense and efficient. This presents tremendous opportunities for research on system architecture and design automation.\u003C/span>\u003C/p>","\u003Cp style=\"text-align:justify;\">Acknowledgements: this work is supported in part by member companies of the Stanford SystemX Alliance, Non-Volatile Memory Technology Research Initiative (NMTRI) at Stanford, and the Differentiated Access Memory (DAM) industrial affiliate program at Stanford. \u003C/p>\u003Cp style=\"text-align:justify;\">References: \u003C/p>\u003Col style=\"list-style-type:decimal;\">\u003Cli style=\"text-align:justify;\">M. Liu, H.-S. P. Wong, “How We’ll Reach a 1 Trillion Transistor GPU,” IEEE Spectrum, March 28, 2024. \u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://spectrum.ieee.org/trillion-transistor-gpu\">https://spectrum.ieee.org/trillion-transistor-gpu\u003C/a>\u003C/li>\u003Cli style=\"text-align:justify;\">T. Srimani, A. D. Bechdolt, S. Choi, C. Gilardi, A. Kasperovich, S. Li, Q. Lin, M. Malakoutian, P. J.  cEwen, R. M. Radway, D. T. Rich, A. Yu, S. Fuller, S. Achour, S. Chowdhury, H.-S. P. Wong, M.\u003Cbr>Shulaker, S. Mitra, “N3XT 3D Technology Foundations and Their Lab-to-Fab: Omni 3D Logic, Logic+Memory Ultra-Dense 3D, 3D Thermal Scaffolding,” IEEE International Electron Devices Meeting (IEDM), paper 39.2, December 11 – 13, San Francisco, 2023\u003C/li>\u003Cli style=\"text-align:justify;\">R.M. Radway, K. Sethi, W.-C. Chen, J. Kwon, S. Liu, T.F. Wu, E. Beigne, M.M. Shulaker, H.-S.P. Wong, and S. Mitra, “The Future of Hardware Technologies for Computing: N3XT 3D MOSAIC, Illusion Scaleup, Co-Design,” IEEE International Electron Devices Meeting (IEDM), paper 25.4, December 13 – 15, San Francisco, 2021.\u003C/li>\u003C/ol>","2024-04-17T18:32:55.839Z","2024-08-30T16:04:42.542Z","2024-04-17T18:32:57.311Z","63",[1479],{"id":390,"name":1480,"committee":15,"position":15,"affiliation":1481,"email":15,"biography":1482,"createdAt":1483,"updatedAt":1483,"url_path_id":1484,"contactPhoto":1485,"socialLinks":1506,"url_path":1507},"Philip Wong","Stanford University","\u003Cp style=\"text-align:justify;\">H.-S. Philip Wong is the Willard R. and Inez Kerr Bell Professor in the School of Engineering at Stanford University. He joined Stanford University as Professor of Electrical Engineering in 2004. From 1988 to 2004, he was with the IBM T.J. Watson Research Center. From 2018 to 2020, he was on leave from Stanford and was the Vice President of Corporate Research at TSMC, the largest semiconductor foundry in the world, and since 2020 remains the Chief Scientist of TSMC in a consulting, advisory role.\u003C/p>\u003Cp style=\"text-align:justify;\">He is a Fellow of the IEEE and received the IEEE Andrew S. Grove Award, the IEEE Technical Field Award to honor individuals for outstanding contributions to solid-state devices and technology, as well as the IEEE Electron Devices Society J.J. Ebers Award, the society’s highest honor to recognize outstanding technical contributions to the field of electron devices that have made a lasting impact.\u003C/p>\u003Cp style=\"text-align:justify;\">He is the founding Faculty Co-Director of the Stanford SystemX Alliance – an industrial affiliate program focused on building systems and the faculty director of the Stanford Nanofabrication Facility – a shared facility for device fabrication on the Stanford campus that serves academic, industrial, and governmental researchers across the U.S. and around the globe, sponsored in part by the National Science Foundation. He is the Principal Investigator of the Microelectronics Commons California-Pacific-Northwest AI Hardware Hub, a consortium of over 40 companies and academic institutions funded by the CHIPS Act. He is a member of the US Department of Commerce Industrial Advisory Committee on microelectronics.\u003C/p>","2024-04-17T18:32:21.782Z","62",{"id":1198,"name":1486,"alternativeText":15,"caption":15,"width":1487,"height":1488,"formats":1489,"hash":1502,"ext":760,"mime":763,"size":1503,"url":1504,"previewUrl":15,"provider":22,"provider_metadata":15,"createdAt":1505,"updatedAt":1505},"philip-wong1509505635305.jpg",350,522,{"small":1490,"thumbnail":1496},{"ext":760,"url":1491,"hash":1492,"mime":763,"name":1493,"path":15,"size":1494,"width":1495,"height":648},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/small_philip_wong1509505635305_a00da14d4b.jpg","small_philip_wong1509505635305_a00da14d4b","small_philip-wong1509505635305.jpg",21.56,335,{"ext":760,"url":1497,"hash":1498,"mime":763,"name":1499,"path":15,"size":1500,"width":1501,"height":622},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/thumbnail_philip_wong1509505635305_a00da14d4b.jpg","thumbnail_philip_wong1509505635305_a00da14d4b","thumbnail_philip-wong1509505635305.jpg",3.16,105,"philip_wong1509505635305_a00da14d4b",24.67,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/philip_wong1509505635305_a00da14d4b.jpg","2024-04-17T18:31:58.769Z",[],"-45","-46",{"id":27,"session":1510},{"id":27,"title":1511,"teaser":1512,"body":45,"createdAt":1513,"updatedAt":1514,"publishedAt":1515,"url_path_id":1516,"contacts":1517,"url_path":1540},"The Future of Chip Design","\u003Ch4 class=\"h4\" style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:#537F9A;\">\u003Cstrong>Tuesday | October 29, 2024 | 8:30 - 9:30\u003C/strong>\u003C/span>\u003C/h4>\u003Cp style=\"text-align:justify;\">In 2030 we will be able to produce 200B transistor monolithic chips and over 1T 3D integrated multi-chiplet solutions. These will get generated from a few million lines of RTL. A massive generation effort. But how much of this will be done with generative AI? How much will be done by classical optimization methods?\u003C/p>\u003Cp style=\"text-align:justify;\">As with any new technology there are a lot of open questions. Why can’t we create a L*M to take a processor written in Verilog and generate 1nm DRC clean and timing optimized layout and by-pass the entire EDA stack? Or can we? What is the place of generative AI in Hardware design? This keynote will give some food for thought to ponder these questions.\u003C/p>","2024-04-17T18:29:51.234Z","2024-08-30T16:05:03.275Z","2024-04-17T18:29:52.838Z","61",[1518],{"id":166,"name":1519,"committee":15,"position":15,"affiliation":1059,"email":15,"biography":1520,"createdAt":1521,"updatedAt":1521,"url_path_id":1522,"contactPhoto":1523,"socialLinks":1538,"url_path":1539},"Leon Stok","\u003Cp style=\"text-align:justify;\">Leon Stok studied electrical engineering at Eindhoven University of Technology, The Netherlands, where he graduated with honors in 1986. He obtained his PhD degree from Eindhoven University in 1991. He worked at IBM’s Thomas J. Watson Research Center as part of the team that developed BooleDozer, the IBM logic synthesis tool. Subsequently, he managed IBM’s logic synthesis group and initiated the development of the first physical synthesis system: PDS, IBM’s Placement Driven Synthesis tool. From 1999 to 2004, he led all of IBM’s design automation research as the Senior Manager Design Automation at IBM Research. He is currently Vice President, Electronic Design Automation at IBM. He entered the field of Design Automation 25 years ago intrigued by the type of problems being posed by Moore’s law. He has enjoyed working on problems from high-level synthesis to prescriptive layout design and DFM. In these 25 years, he attended most of the Design Automation Conferences, as a presenter of his original work in papers, a reviewer of the state of the art in tutorials or as a panelist to give his opinion on current issues. He served in many roles as a member of the DAC executive committee and as the chair of the 48th DAC. He is a Fellow of the IEEE.\u003C/p>","2024-04-17T18:29:13.394Z","60",{"id":1171,"name":1524,"alternativeText":15,"caption":15,"width":564,"height":1525,"formats":1526,"hash":1533,"ext":760,"mime":763,"size":1534,"url":1535,"previewUrl":15,"provider":22,"provider_metadata":15,"createdAt":1536,"updatedAt":1537},"leon-stok-2-1024x683.jpg",433,{"thumbnail":1527},{"ext":760,"url":1528,"hash":1529,"mime":763,"name":1530,"path":15,"size":1531,"width":1532,"height":622},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/thumbnail_leon_stok_2_1024x683_a926302b88.jpg","thumbnail_leon_stok_2_1024x683_a926302b88","thumbnail_leon-stok-2-1024x683.jpg",5.4,146,"leon_stok_2_1024x683_a926302b88",22.98,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/leon_stok_2_1024x683_a926302b88.jpg","2024-04-17T18:28:51.948Z","2024-04-17T18:29:11.760Z",[],"-43","-44",{"id":96,"session":1542},{"id":96,"title":1543,"teaser":1544,"body":45,"createdAt":1545,"updatedAt":1546,"publishedAt":1547,"url_path_id":1548,"contacts":1549,"url_path":1587},"Enabling Analog Design","\u003Ch4 class=\"h4\" style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:rgb(83,127,154);\">\u003Cstrong>Tuesday | October 29, 2024 | 12:00 - 13:00\u003C/strong>\u003C/span>\u003C/h4>\u003Cp style=\"margin-left:0px;text-align:justify;\">Today's computing models see increasing analog content for two reasons: ever-increasing interaction with an analog real world, and the growing realization that computing on analog substrates can, under certain circumstances, be more efficient than traditional digital computing.  To address the new frontiers opened up by this change, it is vital to explore ways in which EDA and systems design can meet the needs of the design community.    This talk will address the problem of building an ecosystem that supports the full integration of analog design into computing substrates.  Components of this ecosystem range from high-level algorithmic support to back-end design and optimization at the transistor and layout levels.  A summary of the current state of the art, and pointers towards future directions, will be presented.\u003C/p>","2024-07-08T17:33:40.212Z","2024-08-30T16:06:21.507Z","2024-07-08T17:33:41.706Z","74",[1550],{"id":409,"name":1551,"committee":15,"position":15,"affiliation":1552,"email":15,"biography":1553,"createdAt":1554,"updatedAt":1555,"url_path_id":1556,"contactPhoto":1557,"socialLinks":1585,"url_path":1586},"Sachin Sapatnekar","University of Minnesota, USA","\u003Cp style=\"text-align:justify;\">Sachin S. Sapatnekar received the Ph.D. degree from the University of Illinois at Urbana-Champaign in 1992.  He was on the faculty at Iowa State University for five years, and since 1997, he has been teaching at the University of Minnesota, where he holds the Distinguished McKnight University Professorship and the Henle Chair Professorship in ECE. His research is related to developing CAD techniques for the analysis and optimization of circuit performance, currently focused on analog and digital CMOS circuits as well as post-CMOS technologies and novel computational models. He has served as Editor-in-Chief of the IEEE Transactions on CAD and General Chair for the ACM/IEEE Design Automation Conference (DAC), and was lead PI of the ALIGN analog EDA project.  He is a recipient of ten conference Best Paper Awards, two ICCAD Ten Year Retrospective Best Paper Awards, the Semiconductor Research Corporation's Technical Excellence Award, the Semiconductor Industry Association University Research Award, a Fulbright award, and the UMN ECE Penrose Teaching Award. He is a Fellow of the IEEE and the ACM.\u003C/p>","2024-07-08T17:31:49.797Z","2024-09-12T20:36:57.617Z","73",{"id":415,"name":1558,"alternativeText":15,"caption":15,"width":1559,"height":1560,"formats":1561,"hash":1580,"ext":760,"mime":763,"size":1581,"url":1582,"previewUrl":15,"provider":22,"provider_metadata":15,"createdAt":1583,"updatedAt":1584},"Sachin Sapatnekar_1.jpg.jpg",779,815,{"small":1562,"medium":1568,"thumbnail":1574},{"ext":760,"url":1563,"hash":1564,"mime":763,"name":1565,"path":15,"size":1566,"width":1567,"height":648},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/small_Sachin_Sapatnekar_1_jpg_eca1277b96.jpg","small_Sachin_Sapatnekar_1_jpg_eca1277b96","small_Sachin Sapatnekar_1.jpg.jpg",34.95,478,{"ext":760,"url":1569,"hash":1570,"mime":763,"name":1571,"path":15,"size":1572,"width":1573,"height":655},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/medium_Sachin_Sapatnekar_1_jpg_eca1277b96.jpg","medium_Sachin_Sapatnekar_1_jpg_eca1277b96","medium_Sachin Sapatnekar_1.jpg.jpg",73.25,717,{"ext":760,"url":1575,"hash":1576,"mime":763,"name":1577,"path":15,"size":1578,"width":1579,"height":622},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/thumbnail_Sachin_Sapatnekar_1_jpg_eca1277b96.jpg","thumbnail_Sachin_Sapatnekar_1_jpg_eca1277b96","thumbnail_Sachin Sapatnekar_1.jpg.jpg",4.72,149,"Sachin_Sapatnekar_1_jpg_eca1277b96",85.31,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/Sachin_Sapatnekar_1_jpg_eca1277b96.jpg","2024-07-08T17:31:29.201Z","2024-07-08T17:31:48.381Z",[],"-50","-51",{"id":5,"session":1589},{"id":5,"title":1590,"teaser":1591,"body":45,"createdAt":1592,"updatedAt":1593,"publishedAt":1594,"url_path_id":1595,"contacts":1596,"url_path":1640},"NSF investments in Semiconductor and Microelectronics ","\u003Ch4 class=\"h4\" style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:#537F9A;\">\u003Cstrong>Wednesday | October 30, 2024 | 8:30 - 9:30\u003C/strong>\u003C/span>\u003C/h4>\u003Cp style=\"margin-left:0px;text-align:justify;\">The talk provides information on investments in semiconductors, microelectronics, and quantum computing across the US National Science Foundation. It also presents an overview of the Computer and Information Science and Engineering (CISE) directorate, highlighting its programs related to semiconductors, microelectronics, design automation, and emerging technologies.\u003C/p>","2024-04-17T18:16:49.041Z","2024-08-30T16:05:51.410Z","2024-04-17T18:16:50.502Z","58",[1597],{"id":81,"name":1598,"committee":15,"position":15,"affiliation":1599,"email":15,"biography":1600,"createdAt":1601,"updatedAt":1602,"url_path_id":1603,"contactPhoto":1604,"socialLinks":1638,"url_path":1639},"Dilma Da Silva","US National Science Foundation","\u003Cp style=\"text-align:justify;\">Dilma Da Silva is a Regent Professor and Holder of the Ford Design Professorship II at the Department of Computer Science and Engineering at Texas A&M University. She serves as Division Director for the Division of Computing and Communication Foundations at the Directorate of Computer and Information Science and Engineering (CISE) at the US National Science Foundation and served as Acting Lead for CISE from December 2023 to May 2024. Her previous roles at Texas A&M include Department Head (2014-2019), Associate Dean (2019-2020), interim director of the Texas A&M Institute of Data Science, and interim director of the Texas A&M Cybersecurity Center. Her primary research interests are distributed systems, operating systems, and computer science education. Before joining Texas A&M, she worked at Qualcomm Research (2012-2014), IBM Research (2000-2012), and the University of São Paulo (1996-2000).\u003C/p>\u003Cp style=\"text-align:justify;\">Dilma is an ACM Distinguished Scientist and a Latinas in Computing group co-founder. She was a member of the board of CRA-WP (Computer Research Association's Widening Participation Committee) from 2008 to 2022. She has chaired over 35 conferences/workshops and participated in over 100 program committees. She has published more than 100 technical papers and has 15 patents.\u003C/p>\u003Cp style=\"text-align:justify;\">Dilma received her doctoral degree in computer science from Georgia Tech in 1997 and her bachelor's and master's degrees from the University of São Paulo, Brazil. She is passionate about enabling the next generation of talent.\u003C/p>","2024-04-17T18:16:23.493Z","2024-08-30T16:02:44.264Z","57",{"id":1130,"name":1605,"alternativeText":15,"caption":15,"width":1606,"height":1607,"formats":1608,"hash":1633,"ext":760,"mime":763,"size":1634,"url":1635,"previewUrl":15,"provider":22,"provider_metadata":15,"createdAt":1636,"updatedAt":1637},"20240122_Da_Silva_Dilma_CG_0003E.jpg",3898,4349,{"large":1609,"small":1615,"medium":1621,"thumbnail":1627},{"ext":760,"url":1610,"hash":1611,"mime":763,"name":1612,"path":15,"size":1613,"width":1614,"height":640},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/large_20240122_Da_Silva_Dilma_CG_0003_E_b056338405.jpg","large_20240122_Da_Silva_Dilma_CG_0003_E_b056338405","large_20240122_Da_Silva_Dilma_CG_0003E.jpg",86.71,897,{"ext":760,"url":1616,"hash":1617,"mime":763,"name":1618,"path":15,"size":1619,"width":1620,"height":648},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/small_20240122_Da_Silva_Dilma_CG_0003_E_b056338405.jpg","small_20240122_Da_Silva_Dilma_CG_0003_E_b056338405","small_20240122_Da_Silva_Dilma_CG_0003E.jpg",24.75,448,{"ext":760,"url":1622,"hash":1623,"mime":763,"name":1624,"path":15,"size":1625,"width":1626,"height":655},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/medium_20240122_Da_Silva_Dilma_CG_0003_E_b056338405.jpg","medium_20240122_Da_Silva_Dilma_CG_0003_E_b056338405","medium_20240122_Da_Silva_Dilma_CG_0003E.jpg",50.12,672,{"ext":760,"url":1628,"hash":1629,"mime":763,"name":1630,"path":15,"size":1631,"width":1632,"height":622},"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/thumbnail_20240122_Da_Silva_Dilma_CG_0003_E_b056338405.jpg","thumbnail_20240122_Da_Silva_Dilma_CG_0003_E_b056338405","thumbnail_20240122_Da_Silva_Dilma_CG_0003E.jpg",4.01,140,"20240122_Da_Silva_Dilma_CG_0003_E_b056338405",1896.44,"https://confcats-siteplex.s3.us-east-1.amazonaws.com/iccad24/20240122_Da_Silva_Dilma_CG_0003_E_b056338405.jpg","2024-04-17T18:15:47.762Z","2024-04-17T18:19:18.815Z",[],"-41","-42",{"id":166,"groupTitle":1642,"sessions":1643},"Synopsys Invited Speaker",[1644],{"id":1130,"session":1645},{"id":1130,"title":1646,"teaser":1647,"body":1648,"createdAt":1649,"updatedAt":1650,"publishedAt":1651,"url_path_id":1652,"contacts":1653,"url_path":1693},"Connecting Science to Commercials: The Road to One Trillion Dollar Club","\u003Ch4 class=\"h4\" style=\"margin-left:0px;text-align:justify;\">\u003Cspan style=\"color:rgb(83,127,154);\">\u003Cstrong>Monday | October 28, 2024 | 12:30 - 13:30\u003C/strong>\u003C/span>\u003C/h4>\u003Cp style=\"text-align:justify;\">Embark on a visionary exploration of the semiconductor industry's path to the coveted One Trillion Dollar Club in our keynote presentation. Delve into three pivotal technology trends shaping this journey:\u003C/p>\u003Cp style=\"text-align:justify;\">Novel AI: Uncover the transformative impact of cutting-edge Artificial Intelligence on semiconductor innovation;  Quantum Computing: Explore the quantum frontier and its profound influence on semiconductor capabilities.\u003C/p>","\u003Cp style=\"text-align:justify;\">Sustainability and Cleantech: Navigate the intersection of semiconductor technology and sustainability.  These trends are propelled by key enabling technologies:  Multi-die Implementation: Unveil the significance of multi-die solutions, revolutionizing semiconductor design to enhance performance, scalability, and efficiency.  Software-Defined Vehicle: Explore the transformative impact of semiconductor technologies on the automotive sector, driving the evolution towards software-defined vehicles.  Pervasive Intelligence: Dive into the realm of pervasive intelligence, where semiconductor technologies seamlessly integrate intelligence into various systems.\u003C/p>\u003Cp style=\"text-align:justify;\">Witness the ripple effect of semiconductor innovation across diverse market segments: Consumer Electronics, Healthcare, Automotive and Communications.  This keynote promises an insightful journey into the transformative technologies and their impact across various market segments, guiding the semiconductor industry towards the prestigious One Trillion Dollar Club. Join us as we navigate the roadmap to unparalleled success and innovation.\u003C/p>","2024-08-29T14:19:20.314Z","2024-08-29T14:20:00.469Z","2024-08-29T14:20:00.464Z","197",[1654],{"id":212,"name":1655,"committee":15,"position":15,"affiliation":1656,"email":15,"biography":1657,"createdAt":1658,"updatedAt":1659,"url_path_id":1660,"contactPhoto":1661,"socialLinks":1690,"url_path":1692},"Brandon Wang","Synopsys, USA","\u003Cp style=\"text-align:justify;\">Brandon Wang is a Vice President, VP of Technology Strategy at Office of the CEO at Synopsys. Brandon oversees corporate level technology roadmaps and strategies for growth, including global strategic and ecosystem partnerships, and M&A/investments for new horizons. He also heads the Chief Innovation Office, championing organic innovations and worldwide academic and research partnerships.\u003C/p>\u003Cp style=\"text-align:justify;\">Prior to joining Synopsys in 2018, Brandon served executive and senior roles at Cadence, ARM, Qualcomm, and Lattice in chief strategy office, product marketing, and R&D organizations for over two decades.\u003C/p>\u003Cp style=\"text-align:justify;\">Brandon is currently serving at the board of Efabless corporation, and as a limited partner/Investment Council member at Imec.Xpand, an affiliated VC to Imec. He is also a Limited Partner at AIX ventures, a leading venture capital firm focusing on AI investment and an LP to Black Opal ventures, who invests in life science and healthcare.\u003C/p>\u003Cp style=\"text-align:justify;\">An Electrical and Computer Engineer by training, Brandon holds 10 patents, and has published at 20+ IEEE conferences, in journal papers and invited talks in the areas of 3D-IC, Machine Learning, HW security, High-speed Interfaces, Low Power CPU, FPGA and Memory Designs. 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